Tag Archives: through silicon vias

Nvidia Jumps on Package-on-Package Bandwagon

Package-on-package got another endorsement last week when Nvidia said it would use 3-D packaging on some forthcoming Pascal graphics processors to make more memory available with minimal delays. The move comes as more industries are adopting the company’s parallel processing chips. Nvidia President and CEO Jen-Hsun Huang made 3-D packaging one of the first highlighted […]