Tag Archives: technical conference

Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]

IPC Issues Call for Participation for IPC E-TEXTILES Europe 2019

by Chris Jorgensen, director, technology transfer IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES Europe 2019 to be held on November 12, 2019 in Munich, Germany. IPC E-TEXTILES Europe 2019 will provide a platform for presenters and their companies to promote […]

IPC APEX EXPO 2016: A Global Experience

IPC APEX EXPO has always been a melting pot of education, training, and technology. In years’ past, the show has focused on delivering the latest in technical research, industry best practices, and providing networking opportunities with industry leaders. The theme of this year’s show is “Forward Thinking for Tomorrow’s Technology.” This mantra couldn’t be more […]

2016 IPC APEX EXPO: What a First Time Attendee Needs to Know

So, you are considering attending IPC APEX EXPO for the first time (or have already registered to attend for your first time). Either way, we are excited to have you be a part of the largest North American tradeshow in the electronics industry. We want this to be an enriching experience for you, an event […]

Pursue New Ideas for New Horizons at IPC APEX EXPO 2014

John Mitchell, IPC president and CEO, invites you to attend IPC APEX EXPO 2014, set to deliver the most progressive and impactful technical and professional development programs as well as a sold out exhibition to feed your mind and help you explore new opportunities.

Copper Pillar Packaging Development Poses Challenges, but Technology Helps Designers Increase Density

Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed boards. Copper pillar micro bump technology is one of the favored chip-to-package interconnection methods, gradually taking the place of conventional techniques that use […]

When You’re Hungry for Knowledge About PoP

Technical conferences generally end with attendees feeling they’ve learned a lot. But once they’ve had time to absorb what they learned, many of them long for more in-depth knowledge. That won’t be a problem for attendees at two upcoming IPC conferences. At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest February […]

NCEDAR 2012 Makes an Impressive Debut

IPC India successfully accomplished its goal of providing the Indian electronics manufacturing industry with state-of-the-art technologies in printed board design and manufacturing. More than 350 participants attended National Conference on Electronics Design, Assembly and Reliability (NCEDAR), held December 4–6, 2012, at the Indian Institute of Science in Bangalore, India. The three-day event opened with a […]