Tag Archives: Solder

Four IPC Global Statistical Programs Now Open

IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC member companies as a benefit of membership. The statistical programs give participating IPC members access to global […]

Nanotechnology Researchers Replace Solder with Water

Advanced research is often really interesting, and often not-so-much. For me, that’s especially true with nanotechnology. Some projects have potential to change things. Others seem like pipe dreams that will take decades to emerge, if they ever advance toward the mainstream. A new study on self-assembling electronics seems to fit in the middle. Researchers from […]

Lead Usage Continues to Grow

Companies in the electronics industry have spent billions in recent years to remove lead from solder, ensuring that the few ounces of this toxic metal on a printed board don’t leach into water supplies. Though regulators are attempting to curtail lead usage, it’s growing by about five percent per year. Global demand for lead is expected […]

Researchers air ideas on eliminating solder

By nature, research projects are surrounded by an air of uncertainty, many of them never progress outside the laboratory. But over time, many of them bear fruit and move into the mainstream. If two projects announced last month gain market acceptance and becomes a success story, they will a have significant impact on board fabrication […]

GOOD NEWS: ELECTRONICS INDUSTRY UNAFFECTED AFTER A YEAR OF EFFORTS

A recent Consumer Product Safety Commission (CPSC) ruling found that inaccessible electronic components in children’s products will not be subject to the lead limits that were enacted last summer under the Consumer Product Safety Improvement Act (CPSIA). This finding is critical to the electronics industry because electronics manufacturers building children’s products will not need to meet CPSIA lead limits, which are lower than the limits in the European Union Restriction on Hazardous Substances Directive.

In the same ruling, CPSC stated that inaccessible component parts do not have to be tested and certified as to the lead content. This means that electronics manufacturers will not be required to conduct expensive third party testing of inaccessible component parts for lead content.

Modeling moves rapidly into the mainstream

The rapid adoption of model-based design has been one of the quickest transformations in system design in recent years. Only a few years ago, about the only time I heard about model-based design was in interviews with tool suppliers like The MathWorks. Over the last year or two, system engineers increasingly bring it up during […]