Tag Archives: rigid/printed boards

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

The second posting in a series of updates from IPC standards committee meetings held at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee revised IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. Changes include: a) DMA thermal analysis testing for more accurate Tg measurement for approximately 20 […]