Tag Archives: Reliability

Watching Tin Whiskers Grow for Nearly a Decade

Tin whiskers remain a vexing issue for many applications, particularly those in aerospace where a decade is often a fraction of a product’s lifetime. One of the key challenges is finding protective techniques that are effective without being excessive. Conformal coatings is one of the technologies used to keep tin whiskers from causing short circuits […]

Focusing on Fluxes

The drive to improve the long-term reliability of printed boards forces researchers to look at several different factors. Many of those factors are quite subtle, like the corrosion fostered by fluxes. For years, countless engineers have used surface insulation resistance (SIR), electrochemical migration (ECM) and corrosion-specific tests to determine the impact of fluxes, which are […]

View from Europe: Solderability and Reliability in Focus at IPC Conference in Budapest

By Lars Wallin, IPC European Representative At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest, Hungary, 130 attendees gathered on February 6–7, to learn more about IPC standards and how these documents are good resources for improving quality, making better materials choices, and achieving “the perfect solder joint.” Mission to Inform […]

Exploring the Impact Enclosures Can Have on Designs

As designers and engineers try to gain an edge in increasingly competitive markets, they’re starting to look beyond semiconductors and printed boards. A growing number of design teams are looking at enclosures, which can have an impact on reliability. IPC is providing some help for designers in the newly released IPC-2221B, Generic Standard on Printed […]

IPC Standards Committee Reports — Assembly, Cleaning/Coating, Product Reliability, Testing, Product Assurance

The third posting in a series of updates from IPC standards committee meetings held at IPC Midwest. Assembly and Joining The 5-21f Ball Grid Array Task Group reviewed comments received on the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs. Many of the revisionsdeal with cratering anomalies and new termination types and […]

Tracking some wild uses of standards

It’s easy to expect the predictable, even in as diverse a group as IPC. Given that IPC Midwest is a regional show, it seemed likely that Midwest attendees would fit into fairly predictable groups: member companies or people from facilities somewhat close to the Chicago area. Making that assumption brought me a clear reminder of […]

IPC Announces Free Webinar on New IPC-CH-65B Cleaning Handbook

FREE webinar: How Clean is Clean Enough? Overview of the NEW IPC-CH-65B Cleaning Handbook Dr. Mike Bixenman, Kyzen Corporation and Kris Roberson, IPC Wednesday, August 17 10:00 am–10:30 am CT Introducing the newest member of the IPC “family,” IPC-CH-65B, Guidelines for Cleaning Printed Circuit Assemblies.   This free webinar provides a short overview of IPC-CH-65B and […]

Gold (Au)- and Silver (Ag)-Embrittlement of Solder Joints

First, the choice of the word ‘embrittlement’ is unfortunate, because it creates a mental image that is misleading. The pictures below of the crystalline AuSn-IMC and AgSn-IMC platelets and their impact on the solder joint structure illustrate the phenomenon much better. “Au/Ag-embrittlement” is the weakening of the SJ structure by too many weak interfaces with […]

Decoupling Performance Class and Quality Assurance testing—YES, and add Reliability

‘Functional Performance’ Classes cannot be equated with ‘Reliability’ classes–they are not the same. I have tried unsuccessfully in the past to put a disclaimer into the scope of these documents, to alert the readers that only an appropriate ‘Design-for-Reliability’ would assure reliability. While good quality—and IPC-6012 and IPC-6013 assure quality, is a requirement for reliability, […]