Tag Archives: plating processes

An Update on 4-14 Plating Processes Subcommittee Activities — Video

George Milad, Uyemura International Corp., co-chair of the IPC 4-14 Plating Processes Subcommittee, provides an update on IPC-4556, an ENEPIG plating for printed circuit boards specification. Watch the video.

Building Long-term Reliability into Printed Circuit Boards

By Mike Carano, OMG Electrochemicals Inc. The threat to the reliability of printed circuit boards (PCBs) comes primarily from one source — the temperatures required during the soldering processes for the assembly of the components onto the PCB. These reliability issues can be mitigated if fabricators understand the ramifications of the material sets chosen for […]