Tag Archives: PCB fabrication

Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies. Intended to reflect differences in producibility, complexity, […]

IPC standards committee updates: printed board design, base materials, fabrication processes and high speed/high frequency

Printed Board Design The IPC 1-10b Current Carrying Capacity Task Group discussed goals for a future revision to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The revision will focus on high current transients, flexible printed boards, microvia structures and new printed board material types. The IPC 1-10c Test Coupon and Artwork […]