Tag Archives: OEMs

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies. Intended to reflect differences in producibility, complexity, […]

IPC Assembly Quality Benchmark Survey Deadline Extended to June 16

The deadline for participation in IPC’s annual Quality Benchmark Survey for Electronics Assembly has been extended to Friday, June 16. This confidential survey is open to OEMs and contract manufacturers that do electronics assembly. Participants who complete the survey will receive a report on the findings at no cost. The survey is online at  www.ipc.org/2017BenchmarkSurvey […]