Tag Archives: OEM

Fail to Prepare, Prepare to Fail

By Jennifer Read, Consultant That’s a quote from Ben Franklin cited by IPC CEO John Mitchell in a video blog about the recently published IPC Study of the North American Labor Pool for Electronics Manufacturing. Recruiting and training the next generation of workers for the PCB industry is one of the most important ways for […]

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

IPC-2581 Consortium Opens its Doors to New Members

Getting OEMs, design tool providers, EMS providers and others to agree on a standard for transferring data files has proven a difficult challenge. The IPC-2581 Consortium, formed to help industry settle on a data transfer document, is beefing up its efforts by opening its membership to individuals. The consortium was created in 2011 by a […]

OEM Summit Takeaways

IPC hosted its first OEM Summit at APEX EXPO last week. Panelists included Martin Rausch, GM, System Manufacturing, Intel; Kitty Pearsall, Ph.D., DE, ISC Procurement Engineering, IBM; and Michael Roesch, Manager, Reliability and Test Engineering, Global Engineering Services, Hewlett-Packard.