Tag Archives: OEM

New Opportunity for Managers Announced, Special Attention to ‘Emerging Managers’

By Tracy Riggan, senior director, Business Development In times like these, effective management skills to navigate uncertainty and fast-paced shifts are critical. Coupled with talent shortages which overburden existing teams, it can be challenging for businesses to build internal mentorship and management training from within. Our members tell us that one of the key areas […]

IPC’s PCB Technology Trends Study Highlights Trends that Will Impact Board Fabricators

By Michael Carano, vice president, technology and business development, RBP Chemical Technology The recent publication of IPC’s 2018 PCB Technology Trends study highlighted several significant trends that will impact the board fabricator going forward over the next five years. Some of the most significant technology trends I see are in the materials segment. We all […]

Fail to Prepare, Prepare to Fail

By Jennifer Read, Consultant That’s a quote from Ben Franklin cited by IPC CEO John Mitchell in a video blog about the recently published IPC Study of the North American Labor Pool for Electronics Manufacturing. Recruiting and training the next generation of workers for the PCB industry is one of the most important ways for […]

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

IPC-2581 Consortium Opens its Doors to New Members

Getting OEMs, design tool providers, EMS providers and others to agree on a standard for transferring data files has proven a difficult challenge. The IPC-2581 Consortium, formed to help industry settle on a data transfer document, is beefing up its efforts by opening its membership to individuals. The consortium was created in 2011 by a […]

OEM Summit Takeaways

IPC hosted its first OEM Summit at APEX EXPO last week. Panelists included Martin Rausch, GM, System Manufacturing, Intel; Kitty Pearsall, Ph.D., DE, ISC Procurement Engineering, IBM; and Michael Roesch, Manager, Reliability and Test Engineering, Global Engineering Services, Hewlett-Packard.