Tag Archives: J-STD-030

IPC committee status reports: Assembly and Joining, Assembly Equipment and Cleaning/Coating

Assembly and Joining The 5-21F Ball Grid Array Task Group reviewed proposals for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs and developed changes that had been identified in previous meetings. The first draft of Revision C should be complete sometime in July. The 5-22F J-STD-001 Handbook Task Group continued work on […]

IPC standards committee updates: Assembly & Joining/Product Assurance; Product Reliability and Cleaning/Coating

Assembly and Joining/Product Assurance The 5-22a Task Group (J-STD-001, Requirements for Soldered Electrical & Electronic Assemblies) and the 7-31b Task Group (IPC-A-610, Acceptability of Electronic Assemblies) had a joint meeting to celebrate publication of Revision E of both of these standards. The 5-22as Task Group continued work on J-STD-001ES, Space Applications Electronic Hardware Addendum, to […]