Tag Archives: IPC Weak Microvia Failures Technology Solutions Subcommittee

IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white […]