Tag Archives: IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee

Microvia Subcommittee Brings Industry Together, Hosts Open Forum

By Chris Jorgensen, IPC director, technology transfer; IPC staff liaison to V-TSL MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee In early 2018, Jerry Magera and J.R. Strickland, Motorola, answered a call for white papers from the IPC V-TSL Technology Solutions Committee. Their white paper, IPC-WP-023, casts a light on an issue that has been […]

Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC […]