Tag Archives: IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface

Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC […]