Tag Archives: IPC standards

An Improved Technique for Translating Drawings

Globalization requires paying attention to many details, some of them unexpected. As IPC began increasing the number of standards that are translated and converting documents into more languages, they quickly found that one drawing can be worse than 1,000 words. Translating large volumes of text in technical documents is challenging, but it’s very straightforward. But […]

New Simplified Pricing Structure for IPC Standards and Technical Documents

On January 12, 2014, IPC is implementing a new, simplified pricing structure for standards and technical documents. The new pricing structure is based on the complexity of the document (number of pages, number of images and color), with three distinct pricing levels: SIMPLE MODERATE COMPLEX $36     – Member Price $52     – Member Price […]

Bob Willis Reviews New Technical Titles

Industry expert Bob Willis has tips on new reference books and IPC standards to help you do your job better. View pdf summary here.

View from Europe: Solderability and Reliability in Focus at IPC Conference in Budapest

By Lars Wallin, IPC European Representative At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest, Hungary, 130 attendees gathered on February 6–7, to learn more about IPC standards and how these documents are good resources for improving quality, making better materials choices, and achieving “the perfect solder joint.” Mission to Inform […]

IPC Pops Up in the Most Unexpected Places

It’s surprising how often mentions of IPC pop up in presentations in many different industries. I should have known that in a broad design software category like product lifecycle management, standards would play a major role. But I was still surprised when not one but two speakers during a Siemens PLM press/analyst gathering mentioned IPC […]

New releases – August 2012

Standards Amendment 1 to IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards. Free Download of Amendment 1. Amendment 1 to IPC-4554, Specification for Immersion Tin Plating for Printed Circuit Boards – includes Amendment 1. Free Download of Amendment 1. HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes […]

Tracking some wild uses of standards

It’s easy to expect the predictable, even in as diverse a group as IPC. Given that IPC Midwest is a regional show, it seemed likely that Midwest attendees would fit into fairly predictable groups: member companies or people from facilities somewhat close to the Chicago area. Making that assumption brought me a clear reminder of […]

IPC New Releases: June 2012

  New Standards: TM-650-MDP(D)F, Method Development Packet (Free Download) Translations: A-610E-IL-HEBREW, Acceptability of Electronic Assemblies (Hebrew Language) TECHTR-11E-CN, PCB Technology Trends (Chinese Language) 2222A-DE, Sectional Design Standard for Rigid Organic Printed Boards (German language) J-STD-001E-HU, Requirements for Soldered Electrical and Electronic Assemblies (Hungarian Language) Multimedia: DVD-164C, Component Color Codes

IPC Committees Welcome New Chairs

The following individuals have been nominated and have accepted new positions as chairs, co-chairs or vice-chairs of standards development and management council committees. IPC gives them a hearty handshake, wishes them well in completing their missions and thanks them in advance for their efforts! 2-18j Lab Report Declaration Task Group chair:  William Haas, Seagate Technology […]

IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit http://www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Assembly and Joining The 5-21e […]