Tag Archives: IPC standards committees

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Current Carrying Capacity Task Group met to discuss a replacement methodology for the legacy IPC-TM-650 Method 2.5.4.1, […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly & Joining, Flex Circuits

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised, balloted and released IPC-4101D, Specification for Base Materials for Rigid and Multilayer […]

IPC standards committee updates: printed board design, base materials, fabrication processes and high speed/high frequency

Printed Board Design The IPC 1-10b Current Carrying Capacity Task Group discussed goals for a future revision to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The revision will focus on high current transients, flexible printed boards, microvia structures and new printed board material types. The IPC 1-10c Test Coupon and Artwork […]