Tag Archives: IPC J-STD-001

IPC Unveils New IPC Korea Standards Committee

With the support of IPC and the Ministry of Trade, Industry & Energy, the IPC Korea Standards Committee officially opened for business on December 15, 2014. The opening ceremony was hosted by Korea Electronics Technology Association (KETA) in Gumi, South Korea, and boasted a list of 31 attendees, including: LIG Nex1, SAMSUNG Thales, Hanwha, and […]

IPC Working Group Focuses on Nuances of Conformal Coating

As products get smaller and denser, factors that used to be fairly easy to deal with can become areas of concern. Conformal coatings are getting increased interest now as usage grows and the quality of coatings comes under more scrutiny. These coatings have typically been applied and examined using a range of related standards. For […]

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated

F’ Revisions Cover More Advanced Technologies IPC has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria […]

Teresa Rowe Aims to Help Committee Chairs Grow

Teresa Rowe has seen a lot of value in IPC’s programs over the past couple decades. They helped her advance in her career, and she’s helped write documents that provide the foundations for continued electronics industry growth. She learned a lot about technology while serving on 25 IPC committees, but that knowledge isn’t what she […]