Tag Archives: IPC assembly and joining

More Updates from IPC Committee Work at IPC Midwest

ASSEMBLY AND JOINING/PRODUCT ASSURANCE The 5-21f Ball Grid Array and 5/21h Bottom Termination Components (BTC) Task Groups discussed the actions taking place in the IPC-709X set of implementation standards. Prior to the Midwest meeting, a plan was developed to start work on an implementation standard for embedded components. The characteristics of this new documents (IPC-7092), […]