Tag Archives: IPC APEX EXPO

A Conversation with Karen McConnell — An Emerging Engineer Program Mentor

July 22, 2019 – 6:29 am

by Linda Stepanich, multimedia writer, IPC IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, […]

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Saying Yes to Opportunities: IPC’s Emerging Engineer Program Offers Career Growth for Electronics Industry Newcomers

June 27, 2019 – 12:07 pm

What makes the IPC Emerging Engineer Program a premier networking and career enriching program? IPC staff spoke to Emerging Engineer Kate Stees, materials & process engineer, Lockheed Martin, about her experience in the program and why she recommends it to other engineers. IPC: Why did you choose to enroll in IPC’s Emerging Engineer program? Stees: […]

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Engineer Connects Education, Industry and IPC

May 3, 2019 – 11:04 am

By Corey Lynn, Marketing Manager, Education As the IPC Education Foundation establishes student chapters, we have partnered with individuals in the electronics industry and academia. Sometimes we get lucky and find someone involved in both. Kris Moyer, lead engineer at Williams International, is an IPC veteran who chairs and participates in several IPC Standards Committees. […]

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IPC APEX EXPO 2019: Hear from the Attendees

April 22, 2019 – 3:27 pm

IPC APEX EXPO 2019, where technology’s future came to together with 9,796 attendees from 56 countries and 440 exhibitors from around the world. Join us in San Diego for IPC APEX EXPO 2020!

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IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

December 7, 2018 – 8:32 am

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white […]

By chrisjorgensen926 | Posted in Boards, Committees, IPC, IPC APEX EXPO, Standards, Technical | Also tagged , , | Leave a Comment

IPC E-Textiles Standards Committee Seeks Comments on Draft of New E-Textiles Standard; Participants Needed to Join Subcommittee to Develop E-Textiles Connectors Guideline

January 4, 2018 – 2:06 pm

By Chris Jorgensen, director, technology transfer The IPC E-Textiles Materials Subcommittee is collecting comments on the first sections of IPC-4931, Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns. This standard will establish the classification system, qualification and quality conformance requirements and electrical/electronic performance requirements for electronically integrated textiles (e-textiles). It also covers similar […]

By chrisjorgensen926 | Posted in Committees, IPC, Manufacturing, Materials, Standards | Also tagged , , , , , , , | Leave a Comment

ECHA Guidance on Substances in Articles Delayed Until Summer

February 2, 2017 – 4:06 pm

The European Chemicals Agency (ECHA) announced earlier this week that the update of their guidance on Substances in Articles will not be published until July or August 2017.  ECHA had previously indicated that guidance would be released in early 2017. The delay is needed to allow ECHA to evaluate the nearly 700 comments on its […]

By Fern Abrams | Posted in Environment, Health and Safety, IPC | Also tagged , , , , , , | Leave a Comment

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

June 20, 2016 – 7:12 am

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

By IPC | Posted in Boards, Committees, IPC, printed electronics, Printed Electronics, Standards, Technical | Also tagged , , , , | Leave a Comment

IPC Standards Committee Reports – Product Data, Shop Floor Communication, Supplier Declaration, EH&S, Conflict Minerals

June 13, 2016 – 6:37 am

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in the series of reports. Product Data The 1-16 Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (IPC-2581) Task Group met to review the changes […]

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IPC Standards Committee Reports – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency

June 6, 2016 – 6:45 am

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

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