Tag Archives: IPC APEX EXPO 2014

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

Pursue New Ideas for New Horizons at IPC APEX EXPO 2014

John Mitchell, IPC president and CEO, invites you to attend IPC APEX EXPO 2014, set to deliver the most progressive and impactful technical and professional development programs as well as a sold out exhibition to feed your mind and help you explore new opportunities.