Tag Archives: ipc-1601

IPC Standards Progress Reports – Boards, Embedded, Flex and More

2010 IPC Electronics Midwest Standards Development Committees Progress Reports Following are brief summaries of select committees, subcommittees and task groups. BASE MATERIALS The 3-11 Laminate/Prepreg Materials Subcommittee continued its work on Amendment 1 to IPC-4101C, Specification for Base Materials for Rigid and Mulitlayer Printed Boards. This meeting covered: 1) the inclusion of DMA testing for […]

IPC board standards committee updates: Handling and storage and embedded device documents make progress

Below are write-ups prepared by IPC staff liaisons after IPC APEX EXPO for select committees: Rigid Printed Boards The D-31b IPC-2221/2222 Task Group reviewed outstanding items for the forthcoming ballot to IPC-2222A, Sectional Design Standard for Rigid Printed Boards. Section 4 relates to laminate properties and significant discussions were held on the need to update […]

What happens in Phoenix… gets reported right here

Select IPC committees held a productive week of meetings in Phoenix in mid-January. Each staff liaison has been asked to share the progress made. John Perry, IPC technical project manager, reported in on his printed board committees below. Printed Board Design The IPC 1-10c Test Coupon and Artwork Generation Task Group met to review a future […]