Tag Archives: intrusive assembly

New Book by Bob Willis Available for Free Download: Pin In Hole Reflow (PIHR) Technology

Pin in Hole Reflow, Pin In Paste, Multi Spot Soldering, Intrusive Assembly – What’s in a name? If you have an interest in Pin in In Hole Intrusive Reflow, Design and Assembly, frequent IPC contributor Bob Willis of the “IPC/NPL Defect of the Month” has a new book out for free download at http://www.pihrtechnology.com “Once again […]