Tag Archives: Intermetallic Compounds

Gold (Au)- and Silver (Ag)-Embrittlement of Solder Joints

First, the choice of the word ‘embrittlement’ is unfortunate, because it creates a mental image that is misleading. The pictures below of the crystalline AuSn-IMC and AgSn-IMC platelets and their impact on the solder joint structure illustrate the phenomenon much better. “Au/Ag-embrittlement” is the weakening of the SJ structure by too many weak interfaces with […]