Tag Archives: Intel

Chips move to 22 nm, high density BGAs

Checking in to see how Moore’s Law is playing out can tell a lot about what’s coming down the road. The future of semiconductors will always be a key driver for laminate and board requirements of the future. A couple of announcements made this week highlight future and current advances. Looking way out, Intel just […]

iNEMI gets new CEO

There’s been a change in leadership at iNEMI. On Monday, the consortium announced that long-time Intel executive Bill Bader took the helm of the research organization. He spent 26 years at the chipmaker, where he served many roles before ending up as general manager of Systems Manufacturing Technology Development. Bader certainly has the knowledge base […]