Tag Archives: ICs

Chips move to 22 nm, high density BGAs

Checking in to see how Moore’s Law is playing out can tell a lot about what’s coming down the road. The future of semiconductors will always be a key driver for laminate and board requirements of the future. A couple of announcements made this week highlight future and current advances. Looking way out, Intel just […]

Small ICs may challenge assemblers

Handling tiny passive components has been a challenge for assemblers for so long that few assemblers pay much attention to the size of components they specify. But in active semiconductors, chipmakers are concerned about their customers’ ability to handle small, low profile devices. Integration in chips and the relentless push to make more powerful portable […]