Tag Archives: high speed/high frequency

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of […]

IPC Standards Committee Reports – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports.   Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports – Terms and Definitions, High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third report in the series. Terms and Definitions The 2-30 Terms and Definitions Committee met to resolve comments to the Final Draft of IPC-T-50M, Terms and […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to […]

IPC Standards Committee Reports – Printed Board Design, Data Generation and Transfer, Electronic Documentation, High Speed/High Frequency

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the fourth and final report in the series. Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group finalized changes to the […]