Tag Archives: high-speed

Updates from IPC Design, Data Transfer and Documentation Committees

What progress are the IPC committees making? Learn more in the area of PCB design, data transfer and documentation from the Electronics Midwest standards development meetings. Interested in joining a committee? Send an e-mail to answers@ipc.org. PRINTED BOARD DESIGN The IPC 1-10c Test Coupon and Artwork Generation Task Group reviewed a future addendum to IPC-2221A, […]

Interview with vice chair of the IPC High-Speed/High-Frequency Committee

Tom Bresnan, R&D Circuits, vice chair of the High-Speed/High-Frequency Committee, explains how the committee supports manufacturers who use high-speed or high-frequency materials. As end-customers increasingly require high-speed materials, more and more volunteers are getting involved with D-20. This interview was done by Ray Rasmussen of iConnect007 during IPC Midwest. View the video here. This link will […]