Tag Archives: HDBK-850

IPC committee status reports: Assembly and Joining, Assembly Equipment and Cleaning/Coating

Assembly and Joining The 5-21F Ball Grid Array Task Group reviewed proposals for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs and developed changes that had been identified in previous meetings. The first draft of Revision C should be complete sometime in July. The 5-22F J-STD-001 Handbook Task Group continued work on […]