Tag Archives: fabrication processes

Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]

IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Component Traceability The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

The second posting in a series of updates from IPC standards committee meetings held at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee revised IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. Changes include: a) DMA thermal analysis testing for more accurate Tg measurement for approximately 20 […]