Tag Archives: embedded devices

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

IPC Standards Committee Reports — Supplier Declaration, EH&S, Management, Embedded Devices, Printed Electronics, Conflict Minerals

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.   Supplier Declaration The 2-18h Conflict Minerals Declaration Task Group discussed potential future changes and enhancements to IPC-1755. […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports – Terms and Definitions, High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third report in the series. Terms and Definitions The 2-30 Terms and Definitions Committee met to resolve comments to the Final Draft of IPC-T-50M, Terms and […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

The second posting in a series of updates from IPC standards committee meetings held at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee revised IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. Changes include: a) DMA thermal analysis testing for more accurate Tg measurement for approximately 20 […]

IPC board standards committee updates: Handling and storage and embedded device documents make progress

Below are write-ups prepared by IPC staff liaisons after IPC APEX EXPO for select committees: Rigid Printed Boards The D-31b IPC-2221/2222 Task Group reviewed outstanding items for the forthcoming ballot to IPC-2222A, Sectional Design Standard for Rigid Printed Boards. Section 4 relates to laminate properties and significant discussions were held on the need to update […]

What happens in Phoenix… gets reported right here

Select IPC committees held a productive week of meetings in Phoenix in mid-January. Each staff liaison has been asked to share the progress made. John Perry, IPC technical project manager, reported in on his printed board committees below. Printed Board Design The IPC 1-10c Test Coupon and Artwork Generation Task Group met to review a future […]