Tag Archives: electronics assembly

PCB Technology Trends 2016 Study Now Available

IPC’s PCB Technology Trends 2016 study shows how PCB fabricators and assemblers are meeting today’s technology demands and looks at the changes expected in the coming years that will affect the whole industry. It is a global study based on data from 118 electronics assembly companies and PCB fabricators worldwide. It presents data on the […]

IPC’s U.S. Skills Gap Study Reveals Skills and Qualifications in Short Supply

In response to mounting concern about the shortage of U.S. workers with skills needed by electronics manufacturers, IPC conducted a “fast-facts” study to learn more about the skills gap as it affects U.S. electronics assembly manufacturers. The results, published within Findings on the Skills Gap in U.S. Electronics Manufacturing, indicate that most companies are having […]

Making Regulations that Make Sense

When regulators develop environmental standards, they suffer from some of the same challenges facing businesses. One is a shortage of funds, so regulators leverage the work of others agencies. That was the case when New England’s Ozone Transport Commission (OTC) revised their “Model Rule for Solvent Degreasing,” which sets air standards for volatile organic compounds (VOCs). […]

Burnish your skills in Budapest 20-22 March

With the new year beginning, make plans to do something new by attending the upcoming IPC Conference on Electronics Assembly in Budapest. The three-day event includes workshops, conference and a table-top exhibition. Learn more at http://www.ipc.org/budapest-conference. Agenda Tuesday, 20 March, 2012: Half-Day Workshops 8:00 Registration, Networking Breakfast 9:00 Workshop 1: Why Are My Solder Joints […]

Causes and Solutions for Solder Ball Defects

Industry expert Bob Willis explains the impact of flux and solder mask on solder ball defects in this video based on the  National Physical Laboratory Defect Database. The defect database allows engineers to search through a range of defects covering components, printed circuit boards, solder joints and assembly problems. The aim is to add more […]