Tag Archives: cleaning

Acronyms, Puns and Ion-free Circuit Boards

Tin whiskers are one of the headaches of the soldering world. In a word, they stink. At least, that’s one takeaway I got from Graham Naisbitt’s presentation during IPC/SMTA High-Reliability Cleaning and Conformal Coating Conference. Naisbitt didn’t really say tin whiskers stink —  rather he explained that many people try to reduce the likelihood of tin whiskers […]

Cleaning up PoP

As package on package technology moves deeper into the mainstream electronics, issues like cleaning are getting much more attention. PoP’s impressive growth, driven in large part by high volume portables like cameras and cell phones, requires fine densities that make it difficult to remove residues after soldering. Zestron America recently did some studies of cleaning […]

IPC APEX EXPO Standards Development Reports: Assembly & Joining, Cleaning & Coating and Assembly Equipment

These committee reports from IPC APEX EXPO should help you keep up-to-date on what’s happening in IPC standards. Visit http://www.ipc.org/committees for more information on standards development, drafts and minutes. The standards tree is another excellent reference with an organizational chart for IPC standards and contact information for the committee liaisons. Assembly and Joining The 5-21e […]

IPC Announces Free Webinar on New IPC-CH-65B Cleaning Handbook

FREE webinar: How Clean is Clean Enough? Overview of the NEW IPC-CH-65B Cleaning Handbook Dr. Mike Bixenman, Kyzen Corporation and Kris Roberson, IPC Wednesday, August 17 10:00 am–10:30 am CT Introducing the newest member of the IPC “family,” IPC-CH-65B, Guidelines for Cleaning Printed Circuit Assemblies.   This free webinar provides a short overview of IPC-CH-65B and […]

More Updates from IPC Committee Work at IPC Midwest

ASSEMBLY AND JOINING/PRODUCT ASSURANCE The 5-21f Ball Grid Array and 5/21h Bottom Termination Components (BTC) Task Groups discussed the actions taking place in the IPC-709X set of implementation standards. Prior to the Midwest meeting, a plan was developed to start work on an implementation standard for embedded components. The characteristics of this new documents (IPC-7092), […]

What happens in Phoenix… gets reported right here

Select IPC committees held a productive week of meetings in Phoenix in mid-January. Each staff liaison has been asked to share the progress made. John Perry, IPC technical project manager, reported in on his printed board committees below. Printed Board Design The IPC 1-10c Test Coupon and Artwork Generation Task Group met to review a future […]