Tag Archives: bumped componnets

Copper Pillar Packaging Development Poses Challenges, but Technology Helps Designers Increase Density

Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed boards. Copper pillar micro bump technology is one of the favored chip-to-package interconnection methods, gradually taking the place of conventional techniques that use […]