Tag Archives: bob willis

Bob Willis Reviews New Technical Titles

Industry expert Bob Willis has tips on new reference books and IPC standards to help you do your job better. View pdf summary here.

When You’re Hungry for Knowledge About PoP

Technical conferences generally end with attendees feeling they’ve learned a lot. But once they’ve had time to absorb what they learned, many of them long for more in-depth knowledge. That won’t be a problem for attendees at two upcoming IPC conferences. At the IPC Conference on Solderability and Reliability for Electronics Assemblies in Budapest February […]

Bob Willis Reviews New Technical Titles

Industry expert Bob Willis has tips on new reference books and IPC standards to help you do your job better. PDF summary of Bob’s recommendations.  

Counterfeit Components CD ROM – Launching in the US at IPC APEX EXPO

By Bob Willis SMART Group is a member of ChipCheck, a European funded project looking at the problems associated with counterfeit components and a practical solution for the electronics industry. Nigel Burtt and Bob Willis from the SMART Group Technical Committee have contributed to an interactive CD-ROM on Counterfeit Components which is being released to […]

Bob Willis’ Top Process Engineers Book List for Christmas

When you want a break from electric shavers and ugly ties, here are some more options for the engineer on your holiday list!  These titles are not all new but some of the best reference books in the industry. If a company does not have 60% of the titles in their library, their engineers are […]

Defect of the Month from NPL and IPC: Solder Wicking and Reflow

Fine pitch components, convection reflow with nitrogen, and vapor phase reflow can all add up to solder wicking where the solder is drawn to either the component terminations or the pads. Industry expert Bob Willis explains the causes in this video from the National Physical Laboratory Defect Database. The defect database allows engineers to search […]

Specific Steps to Protect Your Company from Counterfeit Components by Bob Willis

In this video, Bob Willis discusses specific steps for creating a reference database and golden board assembly to fight against counterfeit components and when, why and how these tools are useful. Bob will be teaching a half-day course on this subject at IPC APEX EXPO on April 8.

Bob Willis with a few thoughts on PoP

Bob Willis shares a few of the issues involved with package-on-package (PoP) assembly in this short video. Issues include advantages of flux or paste, surface finish considerations, investment needed, and requirements for inspection. Bob will be teaching a half-day course on PoP at IPC APEX EXPO on April 8.