Tag Archives: base materials

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Component Traceability The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working […]

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. Why wait? Upgrade to the IPC-4101D-WAM1 today! IPC-4101D-WAM1 […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly and Joining, Flexible Circuits

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined both Amendments 1 and 2 to the IPC-4101D, Specification for Base Materials for Rigid […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly & Joining, Flex Circuits

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised, balloted and released IPC-4101D, Specification for Base Materials for Rigid and Multilayer […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

In Memoriam: Roger A. Jones

IPC staff was recently informed of the death of a valued contributor to the IPC   standards development process. Roger A. Jones, Ph.D., was not only a major contributor to the success of the IPC Flexible Circuits Base Materials Committee, but also a friend to many in the IPC community.Roger passed away on March 22, 2013, […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC’s Fall Standards Development Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

The second posting in a series of updates from IPC standards committee meetings held at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee revised IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. Changes include: a) DMA thermal analysis testing for more accurate Tg measurement for approximately 20 […]