Tag Archives: APEX EXPO

Process Challenges and Metallization Options for Embedding Chip-on-Board into Mainstream SMT

Expert Mukul Luthra discusses this emerging technology

OEM Summit Takeaways

IPC hosted its first OEM Summit at APEX EXPO last week. Panelists included Martin Rausch, GM, System Manufacturing, Intel; Kitty Pearsall, Ph.D., DE, ISC Procurement Engineering, IBM; and Michael Roesch, Manager, Reliability and Test Engineering, Global Engineering Services, Hewlett-Packard.