Tag Archives: A-620

New Releases in July 2012

Standards 2581A(D)F, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology — FREE download. 4921, Requirements for Printed Electronics Base Materials (Substrates) AMENDMENT 1 TO IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards – Includes Amendment 1, The amendment can be downloaded at no charge from the product listing for […]

IPC committee status reports: Assembly and Joining, Assembly Equipment and Cleaning/Coating

Assembly and Joining The 5-21F Ball Grid Array Task Group reviewed proposals for Revision C of IPC-7095, Design and Assembly Process Implementation for BGAs and developed changes that had been identified in previous meetings. The first draft of Revision C should be complete sometime in July. The 5-22F J-STD-001 Handbook Task Group continued work on […]