Tag Archives: 4556

IPC standards committee reports: materials, boards, embedded, flex

This is part of a series of updates from IPC standards committee meetings at IPC Midwest. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee worked on amending IPC-4101C, Specification for Base Materials for Rigid and Multilayer Printed Boards. Proposed items for inclusion were: a) adding DMA thermal analysis testing for measurement of Tg; b) inserting the […]