Tag Archives: 3-D packaging

Nanotechnology Researchers Replace Solder with Water

Advanced research is often really interesting, and often not-so-much. For me, that’s especially true with nanotechnology. Some projects have potential to change things. Others seem like pipe dreams that will take decades to emerge, if they ever advance toward the mainstream. A new study on self-assembling electronics seems to fit in the middle. Researchers from […]

Nvidia Jumps on Package-on-Package Bandwagon

Package-on-package got another endorsement last week when Nvidia said it would use 3-D packaging on some forthcoming Pascal graphics processors to make more memory available with minimal delays. The move comes as more industries are adopting the company’s parallel processing chips. Nvidia President and CEO Jen-Hsun Huang made 3-D packaging one of the first highlighted […]