Tag Archives: 2581

New Releases in July 2012

Standards 2581A(D)F, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology — FREE download. 4921, Requirements for Printed Electronics Base Materials (Substrates) AMENDMENT 1 TO IPC-4552, Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards – Includes Amendment 1, The amendment can be downloaded at no charge from the product listing for […]

IPC Standards Committee Reports: Design, Data Transfer, Documentation, high speeD, high frequency

IPC Standards Committee Reports from IPC Midwest Conference & Exhibition Printed Board Design The 1-10b Current Carrying Capacity Task Group discussed revisions to IPC-2152, Standard for Determining Current Carrying Capacity in Printed Board Design. The task group wants to tap into industry testing for high current, high pulse applications, as well as flexible circuit technology […]

IPC Standards Committees: Progress Reports for Board Design, Fabrication and Related Areas

Keep up with IPC standards committee activities with these status reports published in our recent Intouch Newsletter. For more information on a particular committee, visit our committee home pages , the IPC status of standardization or e-mail answers@ipc.org. Printed Board Design The 1-10C Test Coupon and Artwork Generation Task Group approved Appendix A to IPC-2221B, […]