Tell Us Your IPC Member Story at IPC APEX EXPO 2019

IPC will soon roll out a new membership campaign that will focus on how the electronics industry builds the electronics that improve the quality of life for billions around the globe.

And we want help from IPC members.

Do you have a story to tell about how IPC membership has helped your organization consistently deliver high-quality, high-reliability products that keep us safer, more secure, improve our health or simply make our lives better? If so, we’d like to interview you onsite at IPC APEX EXPO 2019. We are seeking submissions, from which we will choose 8–10 people to record on camera in one-on-one sessions throughout the day on Monday, January 28.

If you are interested, please complete our online form. IPC will review submissions and reach out to those selected by Sunday, January 27, to schedule your session and provide additional details. Please note: you must already be registered for IPC APEX EXPO 2019 to participate.

Thank you in advance for your interest!

The IPC Membership Team

Become an IPC Workforce Champion

Calling all IPC members in the United States: Become an IPC Workforce Champion — Make your company’s pledge today!

IPC Digital Factory at IPC APEX EXPO 2019 to Spotlight Real-world Implementation of IPC CFX Standard

by David Bergman, vice president, Standards and Training

If you had the chance to align your EMS facility with Industry 4.0, set up seamless data communication between all equipment on your line – even conveyors – and be able to track production on all the equipment from any part of the world, would you do it? If you are a machine vendor, would you like to get out of the business of developing and managing bespoke interfaces for your customer? As an OEM, what would you think about one communication software to provide an added dimension over real-time control of product quality, from board assembly to box build?

What if I told you the entry cost for such a communication-enabling software is available at the low, low IPC price of exactly zero dollars? Would it sweeten the deal if I told you that you could plug this software into your existing line in one day?

IPC CFX communication software for smart production (IPC-2591) and HERMES standard for machine-to-machine communication (IPC-HERMES-9852) are industry-developed standards forming the foundation and backbone of Industry 4.0 Applications. IPC CFX-HERMES simplifies and standardizes machine-to-machine communication while also facilitating machine-to-business and business-to-machine solutions.

During IPC APEX EXPO 2019 in San Diego, California, January 29-31, 2019, IPC will demonstrate two live production lines using this standard software in the IPC Digital Factory on the show floor. One line will utilize both HERMES for machine-to-machine communication and CFX for output messages to the cloud, and the second line will utilize CFX.

The HERMES-CFX line will run printed boards of different sizes through the following process sequence using equipment from a variety of manufacturers. We will use boards of different sizes so you can see the power of HERMES, as it communicates upstream to equipment so it can automatically adjust for the new board size. The CFX line will run the same boards through a separate line, and it will use additional equipment as a demonstration of the compatibility of the software.

You will also be able to follow both production lines—in real time—from your mobile device. This will provide you a real-world view of how you will be able to utilize the data reporting from CFX and HERMES in your own facilities.

HERMES-CFX line sequence
Laser marker – ASYS Group
Screen printer – ASM
Solder paste inspection – Saki
Pick and place – Kulick & Soffa
Reflow oven – Heller
Post-over conveyor – Nutek
Post-reflow AOI – Koh Young
X-ray – Test Research, Inc.
ICT – Keysight
Output conveyor – Nutek

CFX line sequence
Input conveyor – Flexlink
Dispense robot – OK International
Solder paste inspection – Koh Young
Pick and place – Fuji
Reflow oven – Heller
Post-oven conveyor – Flexlink
Post-reflow AOI – Pemtron
X-ray – Creative Electron
Buffer conveyor – Flexlink
Inspection conveyor – Flexlink
Rework center – OK International

Each line will run throughout each day of IPC APEX EXPO, so you will have time to see for yourself the simplicity and power of IPC CFX and HERMES. For instance:

It provides a level playing field for smaller companies
Because this is an industry standard and available at no cost, with very little work to be done to implement, you can use the same software as larger, globally located companies.

All manufacturers will save time and money
Developing your own communications software, especially for multi-vendor equipment lines, can cost upwards or $30,000 and take up to a full business quarter to implement. IPC CFX and HERMES are free to industry and can be implemented in a day.

Reduce or eliminate customer follow-up for software issues
One of the IPC Connected Factory Initiative Subcommittee members, who works on the software development side, communicated the ease of CFX and HERMES implementation. He directed one of his customers to the software and the customer loaded and implemented it without the need for technical support.

The software serves as a building block for enhanced production tracking
IPC CFX and HERMES are written in a way that a company can very easily and inexpensively add app-like functionalities for such things as materials traceability or quality improvement.

Adaptable enough for even hand soldering tools
One of the Digital Factory participants, OK International, found a way to make CFX, which was written for MS .Net, work in Linux. Not only does this present even more possibilities for industry participation, they even implemented it into hand soldering tools.

On-demand, real-time data on any piece of equipment worldwide
EMS companies looking to place orders or report to OEM customers on project statuses will be able to see the activity of any piece of equipment in any facility in any part of the world from their computer or handheld device.

These are just a handful examples of the simplicity, value and power of IPC CFX and HERMES.
Visit the IPC Digital Factory during IPC APEX EXPO 2019 to see these standards in action.

IPC Digital Factory
San Diego Convention Center – Sails Pavilion
Tuesday, January 29, 10:00 AM to 6:00 PM
Wednesday, January 30, 9:00 AM to 6:00 PM
Thursday, January 31, 9:00 AM to 2:00 PM

Join the IPC 2-17 Subcommittee Meeting at IPC APEX EXPO
You can learn more about these two standards and how you can shape their direction by attending the 2-17 Connected Factory Initiative Subcommittee meeting during the show. The subcommittee will meet Monday, January 28, 8:00 AM to 12:00 PM in room 17A at the convention center. The meeting is open to anyone.

For more details about IPC CFX-HERMES, the live production line or the 2-17 meeting, e-mail me at DavidBergman@ipc.org.

How is the U.S. Government Shutdown Affecting Your Business?

by Ken Schramko, senior director, North American government relations

You have probably seen news reports about the various ways that the U.S. Government partial shutdown is affecting “regular people.”

So we were wondering: How it is affecting the electronics industry, if at all? How is it affecting your company?

Please help us by taking a minute now to answer an IPC survey on this issue. Your answers will help us understand the situation better and advocate on your behalf. We’ll publish the results here in about 7-10 days and alert you in an upcoming edition of IPC Global Insight, IPC’s weekly e-newsletter.

In the meantime, this two-page document from our colleagues at Prime Policy provides an overview of which government agencies and functions are most affected. To cite just a few examples: About 95% of the U.S. EPA’s staff are on furlough; as are about half the staff at the White House office that reviews and approves pending regulations. The State Department will keep issuing passports and visas until they run out of funds; and taxpayers will not have services to help with taxes.

Fabrication and Assembly Challenges to be Covered at the Executive Forum for Advancing Automotive Electronics at IPC APEX EXPO 2019

Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to produce fine lines and dissipate heat.

Tier 1 providers will discuss what is expected and what they are doing to improve reliability. Industry icons from Asia and Europe will join American leaders to provide information to help you meet tomorrow’s fabrication and assembly challenges. This not-to-be-missed event will be held at IPC APEX EXPO 2019 on January 28 in San Diego.

Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.

For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.

Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface.

The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee.

IPC Weak Microvia Interface Open Forum
Wednesday, January 30
10:15 AM to 12:00 PM
San Diego Convention Center
Room 11A

Agenda

10:15-10:20 AM – Introduction and Organization / IPC Solutions Committee Logistics
Chris Jorgensen, IPC staff

10:20-10:30 AM – Background: History of the effort, scope of work, status and organization
Marc Carter, V-TSL-MVIA Chair

10:30-10:45 AM – Presentation: Current Understanding of the Problem/Mitigation Measures
Jerry Magera and J.R. Strickland, Motorola

10:45-11:05 AM – Weak Microvia Interface Project Subteam Reports
• Data Collation and Mining on the Issue
Happy Holden
Using results of tests already conducted by various organizations to establish “knowns” vs. “unknowns” for further study and/or confirmation

• FMEA “Fishbone”

Presentation on what the group has done so far, the categories and that we need volunteer experts to help fill in that information

• Engineering Simulation
Marc Carter

Initial high-level model debugging
Incorporating data collation and Fishbone targets going forward

11:05-11:30 AM – Next Steps and Goals
• Near term:
o Breakout teams (plan for Thursday working meeting based on Fishbone)
Marc Carter
o Published literature and public data “mining” effort
Mike Carano, V-TSL Committee Chair
• Middle term:
o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated in another white paper?
o Identify Testing Needed: Gaps and confirmation
o Capture suggestions from the floor (continue during Q&A/Discussion)
• Long term: Prevention: Can it be accomplished through design, process enhancements, etc.?

11:30AM-12:00PM – Q&A Session and How to Get Involved

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.

For more information on the IPC V-TSL-MVIA Subcommittee, e-mail me at ChrisJorgensen@ipc.org.

Join the IPC E-Textiles Standards Group in Europe

By Chris Jorgensen, director, technology transfer

IPC has received interest from several volunteers in Europe to form an e-textiles standards interest group in Europe. Volunteers from this group would meet to influence IPC standards activities, form working groups to develop new IPC standards and to network under the umbrella of developing standards.

If you would like to be added to the roster for this interest group, so you can stay abreast of its activities, e-mail me at ChrisJorgensen@ipc.org. The group is open to anyone and at no cost or obligation.

For more information on the formation of this interest group and potential working groups in Europe, as well as how to participate in other IPC e-textiles standards activities, view the slide deck from the December 13 meeting to the European e-textiles market.

Top Reasons to Attend IPC APEX EXPO 2019

IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business.

The Workforce Conundrum: The Gender Question

In Part 10 of IPC President and CEO John Mitchell’s blog series on workforce issue, John covers gender differences in the workplace.

As I mentioned last week, in Part 5: Demographic Differences, we reviewed two primary topics: generational differences and gender differences. In today’s blog, we discuss discoveries around gender as it concerns the workplace and talk about what companies and organizations might do to enhance their success when confronting any challenges.

Differences Expected

Again, let me reiterate the danger of generalizations (some of which we are about to report on) when it comes to gender. Every individual is indeed that – an individual. What we will be sharing below represents trends, not absolutes, so to get the best results you will need to know your people well. Really well. Which leads us to our first point – Communication.

READ MORE…

IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white paper that cast a light on how a weak microvia interface is a hidden reliability threat.

The subcommittee will hold an open forum for industry to learn about its activities as well as its planned path forward. Attendees will be invited to share their own issues regarding weak microvia interfaces and will learn how to participate on the subcommittee.

IPC Weak Microvia Interface Open Forum
Wednesday, January 30, 2019
10:15 AM to 12:00 PM
San Diego Convention Center
Room 11A

Order IPC WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface from the IPC bookstore.

For more information on the IPC V-TSL-MVIA Subcommittee, contact me at ChrisJorgensen@ipc.org.