Category Archives: Printed Electronics

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports – Terms and Definitions, High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third report in the series. Terms and Definitions The 2-30 Terms and Definitions Committee met to resolve comments to the Final Draft of IPC-T-50M, Terms and […]

Predictions for printed electronics don’t remove uncertainty

Printed electronics have been used for years, but there’s a general consensus that the technology is about to explode, becoming an industry instead of a niche. Electronics manufacturers have made membrane switches and other components for years, and others are printing throw-away medical products using additive techniques. Printed electronics can have substrates ranging from glass […]