Category Archives: Uncategorized

Learn what Siemens PLM can do for you at IPC APEX EXPO

Don’t miss Siemens PLM Software at IPC APEX EXPO 2017 on Wednesday, February 15 at 10:00 AM and 4:00 PM, when our experts will be on hand to answer your questions related to our posters describing exciting new technologies and the strategies to implement them.  Look for the Siemens posters in public hallway areas of IPC APEX EXPO. Additive […]

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

EPA Releases TSCA Reform Implementation Plan

Last week, the Frank R. Lautenberg Chemical Safety for the 21st Century Act was signed into law by President Obama. This is the first major overhaul of the Toxic Substances Control Act (TSCA) since it was enacted into law in 1976. On the front lines, IPC advocated for TSCA reform and applauded Congress for passing […]

China and the United States Move Forward on Conflict Minerals Cooperation

On June 7, under the umbrella of the U.S.-China Strategic and Economic Dialogue, the U.S. and China recognized that responsible mineral supply chain practices promote stability and prosperity in the African Great Lakes region. The two sides welcomed each other’s efforts in this area. Both sides expect to encourage exchanges and the sharing of best […]

Toxics Law May Give Some Regulatory Relief

IPC was proud to see Bloomberg Government’s coverage of the newly reformed TSCA bill, which was signed into law on June 22. Fern Abrams, director of regulatory affairs and government relations for IPC, is mentioned in the article and offers insights on what this bill will mean for the manufacturing industry. You can read the […]

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports – Terms and Definitions, High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third report in the series. Terms and Definitions The 2-30 Terms and Definitions Committee met to resolve comments to the Final Draft of IPC-T-50M, Terms and […]

Brent Grazman, Vice President for Quality at Viasystems to Testify on Capitol Hill

Tomorrow, February 4, at 10:00 am ET, Brent Grazman, Vice President for Quality at Viasystems will be testifying on behalf of IPC before the House Energy and Commerce Subcommittee on Environment and the Economy regarding the efforts to reform the Toxic Substances Control Act (TSCA). To see him testify, visit http://energycommerce.house.gov/hearing/testing-chemicals-and-reporting-and-retention-information-under-tsca-sections-4-and-8. This is a great […]

Chips, Packaging Get Closer as Industry Moves to 3-D Packaging

The fact that all technologies in a system are increasingly interconnected is one of the truisms of this era. As densities get finer, cost pressures increase and quality requirements rise, it’s critical that every aspect of a system work in harmony. This trend is blurring the lines between semiconductors and packaging. That’s an interesting phenomenon […]