Category Archives: Uncategorized

IPC Solicits Member Feedback on Environmental Regulation

IPC is collecting member views on the ongoing European Commission public consultation on the Interface between chemical, product and waste legislation (CPW Interface). This EU initiative will have significant impacts on business through the supply chain as it looks at tracking substances of concern (which are yet to be defined), on top of ECHA’s upcoming […]

IPC Provides Comments to USTR on Domestic Impact of Proposed Tariff Rate Increases on Chinese Imports

Today, May 11, IPC provided comments to the Office of the U.S. Trade Representative (USTR) on the domestic impact of proposed tariff rate increases on Chinese imports  May 11, 2018 The Honorable Robert Lighthizer U.S. Trade Representative Office of the United States Trade Representative 600 17th Street, NW Washington, DC 20508 RE: Proposed Determination of […]

IPC Supports Historic Tax Reform Bill

BANNOCKBURN, Ill., USA, December 19, 2017 – IPC – Association Connecting Electronics Industries® announced its support for the conference report on H.R. 1, the Tax Cuts and Jobs Act, which is under consideration in the U.S. House and Senate. Final votes in each chamber are expected this week and could happen as soon as today. Several […]

India Makes Manufacturing Gains to Participate in a Global Economy

John Mitchell, IPC president and CEO, discusses the state of the manufacturing industry in India.

Learn what Siemens PLM can do for you at IPC APEX EXPO

Don’t miss Siemens PLM Software at IPC APEX EXPO 2017 on Wednesday, February 15 at 10:00 AM and 4:00 PM, when our experts will be on hand to answer your questions related to our posters describing exciting new technologies and the strategies to implement them.  Look for the Siemens posters in public hallway areas of IPC APEX EXPO. Additive […]

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

EPA Releases TSCA Reform Implementation Plan

Last week, the Frank R. Lautenberg Chemical Safety for the 21st Century Act was signed into law by President Obama. This is the first major overhaul of the Toxic Substances Control Act (TSCA) since it was enacted into law in 1976. On the front lines, IPC advocated for TSCA reform and applauded Congress for passing […]

China and the United States Move Forward on Conflict Minerals Cooperation

On June 7, under the umbrella of the U.S.-China Strategic and Economic Dialogue, the U.S. and China recognized that responsible mineral supply chain practices promote stability and prosperity in the African Great Lakes region. The two sides welcomed each other’s efforts in this area. Both sides expect to encourage exchanges and the sharing of best […]

Toxics Law May Give Some Regulatory Relief

IPC was proud to see Bloomberg Government’s coverage of the newly reformed TSCA bill, which was signed into law on June 22. Fern Abrams, director of regulatory affairs and government relations for IPC, is mentioned in the article and offers insights on what this bill will mean for the manufacturing industry. You can read the […]

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]