Category Archives: Trade Show

Copper Pillar Packaging Development Poses Challenges, but Technology Helps Designers Increase Density

Designers of electronic products are always pushing to reduce size and weight while adding more functionality. That often puts them at the forefront of the evolution of high density chips and printed boards. Copper pillar micro bump technology is one of the favored chip-to-package interconnection methods, gradually taking the place of conventional techniques that use […]

Failure Analysis for Improved Reliability

Failure analysis is a vital tool in the effort to ensure reliability of electronic products and systems throughout their product lifecycle. Today, organizations involved in activities within the electronics supply chain are facing new challenges, not just from complex assembly styles, harsher lifecycle environments, and more sophisticated tools, but also from customers who are demanding […]

Highlighting the Fun Side of Technology

The best keynote speeches at trade shows often come from speakers who highlight the fun in technology and engineering. They acknowledge that there’s a lot of grunt work involved in most technical programs, but coming up with a good solution makes the hard work worthwhile. Three very different speakers will bring some fun to IPC […]

IPC Electronics Systems Technology Conference (IPC ESTC) Leads off with Back-to-back Home Runs

Dr. Tin-Lup Wong, distinguished engineer and executive director for Lenovo got IPC ESTC in Las Vegas off to a great start. Dr. Wong gave a keynote presentation that provided attendees an outstanding glimpse to the future of product development at Lenovo. Dr. Wong provided valuable insights to the challenges that ultraslim form factor is creating […]

IPC Standards Committee Reports – Printed Board Design, Data Generation and Transfer, Electronic Documentation, High Speed/High Frequency

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the fourth and final report in the series. Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group finalized changes to the […]

IPC Standards Committee Reports — Assembly, Cleaning/Coating, Reliability, Testing, Assurance

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the third report in the series. Assembly and Joining The 5-21f Ball Grid Array Task Group completed their work on IPC-7095C, Design and Assembly Process […]

Transition to Handhelds Impacts Business, Technology Strategies

We’ve been in a period called the post-PC era for several years, yet there’s still an ongoing transition to new devices. Smart phones, Tablets and Netbooks are seeing spectacular growth while sales of PCs have remained solid, roughly matching 2009 sales even after a recent free fall in shipments. Understanding how this transition will play […]

IPC Standards Committee Reports — Base Materials, Fabrication Processes, Boards, Embedded Devices

Reports from IPC standards meetings at IPC APEX EXPO 2013 have been summarized to keep you up to date on committees’ work in advancing new and revised industry guidelines. This is the second report in the series. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards […]

Automakers Look Beyond Modeling and Simulation

The auto industry’s blend of high volumes, high reliability and low costs makes it a harbinger of trends. A show like the SAE World Congress attracts a lot of technical people, ranging from CEOs to fellows to engineers, all with an idea of how they’re pushing technology forward. A few years ago, it seemed like […]

Advancing Electronics Manufacturing in Brazil

David Bergman, IPC’s vice president of international relations, will participate in FIEE – the 27th International Electrical, Energy and Automation Industry Fair, April 1–5, 2013 in São Paulo, Brazil. This event marks IPC’s first formal presence at a Latin American electronics industry conference and exhibition. While at the fair, Bergman, along with staff from ALN […]