Category Archives: Trade Show

Get your questions on export control regulations answered at IPC APEX EXPO

Learn about the new export control regulations and changes to ITAR restrictions for electronics

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

Trade Show Pact Ensures “Building through Resilience”

IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair last year (IPC & HKPCA Show), the two agreed to co-host the event for four more years. The show will be held […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

Do You Know which Stencil Works Best?

Photo Stencil  Staff Present “Print Performance Studies Comparing Electroform and Laser-cut Stencils” at IPC APEX EXPO   S04-Printing I, March 25 from 1:30-3:30 PM Photo Stencil, LLC staff  will present, “Print Performance Studies Comparing Electroform and Laser-cut Stencils,” at IPC APEX EXPO on Tuesday, March 25th from 1:30–3:30 pm at Technical Session S04-Printing I. Presented by Rachel […]

Satisfying the Hunger for Knowledge

When people decide which trade show they want to attend, they often face a choice that’s a bit like picking a restaurant. They can go to a buffet-like conference where there are many different presentations that don’t have a lot of depth, or go to a specialized show that offers truly good information in a […]

3D IC Packaging and 2.5D/3D IC Integration

PD30, Thursday, March 27, 2014, from 2:00 to 5:00 pm 2.5D/3D IC integration is taking the semiconductor industry by storm. It has been: (a) impacting chip suppliers, fab-less design houses, foundries, integrated device manufacturers, outsourced semiconductor assembly and test, substrates, electronic manufacturing service, original design manufacturers, original equipment manufacturers, material and equipment suppliers, universities, and research […]

Fundamental Considerations to EMC and High Speed Signal Behavior on PCBs

Following Albert Einstein’s model of making things as simple as possible, but not simpler, you too, can become an EMC-competent board designer by understanding what happens, rather than merely learning rules. On Monday, March 24, 2014, from 2:00 pm to 5:00 pm, I, along with course attendees will examine sources of RF; electric and magnetic […]

Watching Tin Whiskers Grow for Nearly a Decade

Tin whiskers remain a vexing issue for many applications, particularly those in aerospace where a decade is often a fraction of a product’s lifetime. One of the key challenges is finding protective techniques that are effective without being excessive. Conformal coatings is one of the technologies used to keep tin whiskers from causing short circuits […]

DFX or How I Learned How to Stop Worrying by Designing Reliability In

One of the most useful things I’ve learned after spending more than 15 years as a process engineer is that assembly processes can easily make a design worse but they can never make it better. Decisions made early in the design phase ultimately predict final product success. Poor material choices, marginal suppliers, incorrect pad geometries […]