Category Archives: Trade Show

IPC APEX EXPO 2019: Hear from the Attendees

IPC APEX EXPO 2019, where technology’s future came to together with 9,796 attendees from 56 countries and 440 exhibitors from around the world. Join us in San Diego for IPC APEX EXPO 2020!

Seven Takeaways from IPC APEX EXPO 2019

By Chris Mitchell, IPC Vice President of Global Government Relations IPC’s most recent annual conference and trade show, IPC APEX EXPO 2019, took place in late January, and by all indications, it was among the best IPC shows ever! The overall success and quality of IPC APEX EXPO is a testament to the innovation and […]

IPC Digital Factory at IPC APEX EXPO 2019 to Spotlight Real-world Implementation of IPC CFX Standard

by David Bergman, vice president, Standards and Training If you had the chance to align your EMS facility with Industry 4.0, set up seamless data communication between all equipment on your line – even conveyors – and be able to track production on all the equipment from any part of the world, would you do […]

Fabrication and Assembly Challenges to be Covered at the Executive Forum for Advancing Automotive Electronics at IPC APEX EXPO 2019

Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to […]

Top Reasons to Attend IPC APEX EXPO 2019

IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business.

What Will You Discover at IPC APEX EXPO 2018?

John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018.

PD18 : Preventing Production Defects and Product Failures

Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost, and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and […]

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

Preventing Production Defects and Product Failures

By Dr. Jennie S. Hwang, Ph.D., D.Sc. CEO & Principal, H-Technologies Group & Board Trustee & Distinguished Adj. Professor, Case Western Reserve University Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments […]

IPC APEX EXPO 2016: A Global Experience

IPC APEX EXPO has always been a melting pot of education, training, and technology. In years’ past, the show has focused on delivering the latest in technical research, industry best practices, and providing networking opportunities with industry leaders. The theme of this year’s show is “Forward Thinking for Tomorrow’s Technology.” This mantra couldn’t be more […]