Category Archives: Trade Show

PD18 : Preventing Production Defects and Product Failures

Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost, and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments in packaging and assembly and with the goal of achieving high yield and reliability in mind, the “how-to” prevent prevailing production defects and […]

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

Preventing Production Defects and Product Failures

By Dr. Jennie S. Hwang, Ph.D., D.Sc. CEO & Principal, H-Technologies Group & Board Trustee & Distinguished Adj. Professor, Case Western Reserve University Under today’s manufacturing and market environment, the effort to maximize production yield, reduce cost and assure product reliability is becoming increasingly important to a company’s competitiveness. Considering the new and anticipated developments […]

IPC APEX EXPO 2016: A Global Experience

IPC APEX EXPO has always been a melting pot of education, training, and technology. In years’ past, the show has focused on delivering the latest in technical research, industry best practices, and providing networking opportunities with industry leaders. The theme of this year’s show is “Forward Thinking for Tomorrow’s Technology.” This mantra couldn’t be more […]

2016 IPC APEX EXPO: What a First Time Attendee Needs to Know

So, you are considering attending IPC APEX EXPO for the first time (or have already registered to attend for your first time). Either way, we are excited to have you be a part of the largest North American tradeshow in the electronics industry. We want this to be an enriching experience for you, an event […]

Get your questions on export control regulations answered at IPC APEX EXPO

Learn about the new export control regulations and changes to ITAR restrictions for electronics

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

Trade Show Pact Ensures “Building through Resilience”

IPC has bolstered its footprint in Asia, extending an alliance with the Hong Kong Printed Circuit Association (HKPCA). After successfully teaming up to run the International Printed Circuit & APEX South China Fair last year (IPC & HKPCA Show), the two agreed to co-host the event for four more years. The show will be held […]

IPC Standards Committee Reports: Base Materials, Fabrication, High Speed/High Frequency, Embedded Devices

These standards committee reports from IPC APEX EXPO 2014 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised and balloted IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. […]

Do You Know which Stencil Works Best?

Photo Stencil  Staff Present “Print Performance Studies Comparing Electroform and Laser-cut Stencils” at IPC APEX EXPO   S04-Printing I, March 25 from 1:30-3:30 PM Photo Stencil, LLC staff  will present, “Print Performance Studies Comparing Electroform and Laser-cut Stencils,” at IPC APEX EXPO on Tuesday, March 25th from 1:30–3:30 pm at Technical Session S04-Printing I. Presented by Rachel […]