Category Archives: Technical

Industry Groups Concerned by Silica Standard; PCB Manufacturers Should Take Note

By Bret Bruhn, TTM Technologies; Fern Abrams, IPC The Occupational Safety and Health Administration’s (OSHA’s) new standard for silica dust, published March 24, 2016, cuts the allowable 8-hour time weighted average (TWA) exposure limit for silica dust from 100 mg/l to 50 mg/l.  Printed board manufacturing involves drilling and routing of laminates containing silica glass […]

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

IPC Standards Committee Reports These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group met to review the […]

The New IPC Standards Gap Analysis Helps Your Bottom Line

How well do you know your manufacturing process? Are costly inconsistencies impacting your bottom line? IPC Standards Gap Analysis (SGA) is designed to enhance the financial success of IPC member companies. The service offered by IPC, examines your current manufacturing processes to uncover inconsistencies and provide a confidential report highlighting areas where improvements can be […]

IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry. Each year, terms and definitions become relevant in the electronics industry and in the manufacturing process. To meet these needs, IPC-T-50 Revision M, Terms and Definitions […]

IPC Standards Committee Reports — Data Generation and Transfer, Supplier Declaration, Electronic Documentation, EHS, Management, Intellectual Property

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Data Generation and Transfer The 2-16 Product Data Description (Laminar View) Subcommittee continued discussion of potential new requirements and possible […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly and Joining, Flexible Circuits

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined both Amendments 1 and 2 to the IPC-4101D, Specification for Base Materials for Rigid […]

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Current Carrying Capacity Task Group met to discuss a replacement methodology for the legacy IPC-TM-650 Method 2.5.4.1, […]

3D IC Integration and 3D IC Packaging

3D IC integration will be a hot topic at IPC APEX EXPO

IPC Unveils New IPC Korea Standards Committee

With the support of IPC and the Ministry of Trade, Industry & Energy, the IPC Korea Standards Committee officially opened for business on December 15, 2014. The opening ceremony was hosted by Korea Electronics Technology Association (KETA) in Gumi, South Korea, and boasted a list of 31 attendees, including: LIG Nex1, SAMSUNG Thales, Hanwha, and […]