Category Archives: Technical

IPC is Seeking Participants for Technical Education Program Committee

IPC is seeking volunteers who represent all segments of the electronics manufacturing industry, for our Technical Education Program Committee, to help guide, create and develop high-quality educational programs through conferences, tutorials and workshops. This is a great opportunity to collaborate with your industry colleagues and to become more involved with IPC. For more information, contact […]

Don Dupriest Elected to Chair Top IPC Standards Leadership Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed […]

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. Unlike potting, where the […]

What Will You Discover at IPC APEX EXPO 2018?

John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018.

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies. Intended to reflect differences in producibility, complexity, […]

New EU Measures to Better Enforce Intellectual Property Rights

The European Commission published on 29 November the EU IP package, which aims to promote a balanced enforcement of intellectual property (IP) rights and protect supply chains against IP infringement threats. It is estimated that IPR-intensive sectors account for around 42 percent of EU GDP, generate 38 percent of all jobs, and contribute to as […]

IPC to Host Free Webinar on New E-Textiles Standard Activity

by Chris Jorgensen, Director, Technology Transfer Does your company manufacture or purchase e-textiles materials for use in your products? If so, you will want to attend a free IPC webinar on a new standard being developed by the IPC E-Textiles Materials Subcommittee. IPC-4931, Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns will be […]

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

EU Commission Launches Consultation on Two New Exemption Requests

The EU RoHS Directive 2011/65/EU restricts the use of certain hazardous substances in electrical and electronic equipment. BiPRO GmbH has been commissioned by DG ENV to provide technical assistance regarding the evaluation of applications and the related stakeholder consultations, for the following two new exemptions: Cadmium in video cameras designed for use in environments exposed to […]