Category Archives: Technical

3D Packaging and Fan-Out Wafer-Level Packaging (FOWLP)

By: John H Lau, ASM, john.lau@asmpt.com Apple has been shipping their iPhone 7/7+ with their A10 application processor (AP) packaged by TSMC’s InFO (integrated fan-out) wafer-level packaging technology (or simply FOWLP) since September 2016. This is very significant, since Apple and TSMC are the “sheep leaders”. Once they used it, then many others will follow. […]

EU Commission Launches Consultation on Two New Exemption Requests

The EU RoHS Directive 2011/65/EU restricts the use of certain hazardous substances in electrical and electronic equipment. BiPRO GmbH has been commissioned by DG ENV to provide technical assistance regarding the evaluation of applications and the related stakeholder consultations, for the following two new exemptions: Cadmium in video cameras designed for use in environments exposed to […]

IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of […]

New Electronics Industry Market Data Now Available by Subscription

IPC is introducing three new quarterly subscription reports. These exclusive reports provide electronics manufacturers a competitive edge that comes from having solid, timely and reliable market research data. Reports include: Global Solder Market Report  – The report covers trends in solder and flux consumption, including growth rates, tin/lead vs. lead-free ratios, and industry growth outlook […]

IPC Standards Committee Reports — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

IPC Standards Committee Reports These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports. Packaged Electronic Components The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft […]

IPC Standards Committee Reports – Assembly and Joining, Component Traceability, Flexible Circuits, High Speed/High Frequency

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports – Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group announced the release of the IPC-2221B Gerber Coupon Generator. The […]

Industry Groups Concerned by Silica Standard; PCB Manufacturers Should Take Note

By Bret Bruhn, TTM Technologies; Fern Abrams, IPC The Occupational Safety and Health Administration’s (OSHA’s) new standard for silica dust, published March 24, 2016, cuts the allowable 8-hour time weighted average (TWA) exposure limit for silica dust from 100 mg/l to 50 mg/l.  Printed board manufacturing involves drilling and routing of laminates containing silica glass […]

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

IPC Standards Committee Reports These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group met to review the […]

The New IPC Standards Gap Analysis Helps Your Bottom Line

How well do you know your manufacturing process? Are costly inconsistencies impacting your bottom line? IPC Standards Gap Analysis (SGA) is designed to enhance the financial success of IPC member companies. The service offered by IPC, examines your current manufacturing processes to uncover inconsistencies and provide a confidential report highlighting areas where improvements can be […]