Category Archives: Technical

Solving the Surface Finish Selection Paradox

By Kunal Shah, Ph.D., LiloTree Surface finish is applied on to copper (Cu) integration scheme on printed circuit boards (PCBs) and semiconductors wafers. Choice of surface finish is critical because the performance and reliability of the electronic assemblies depends on the right selection. There are several options available in the market and one (OEM, PCB […]

IPC Creates Two New Videos in Cooperation with PACE Worldwide

IPC has released two award winning videos this year in cooperation with PACE Worldwide: 115C – Soldering Iron Tip Care (Communicator Award)  and 194C – SMT Component Removal (Telly Award). According to Mark Pritchard, IPC Video producer,  “IPC has a long history of cooperation with PACE dating back to the 1990s.  PACE has been a […]

Strong and Varied Opinions Expected at IPC Microvia Virtual Summit

The upcoming IPC Microvia Virtual Summit (July 15-16) offers presentations from subject matter experts focused on determining the root causes for observed weak interface failures as well as mitigation techniques and test protocols. IPC Events Connection (EC) editorial staff went behind the scenes to talk to IPC’s John Perry, director, printed board standards and technology, […]

IPC Offers Opportunities for Online Learning

IPC offers many opportunities for online learning, providing relevant education to meet the needs of the industry, from operators to engineers and executives. Events Connection (EC) editorial staff talked to Carlos Plaza, IPC director of education development, about how IPC chooses which courses will benefit the industry, and what options are available for students this […]

Deadline Extended for TSCA Fees Rule Self-Identification Obligation

by Kelly Scanlon, director, environment, health and safety policy & research IPC has posted on February 26 and March 26 regarding industry’s responsibility to determine if they are obligated to pay fees to the U.S. Environmental Protection Agency (EPA) in 2020 to support risk evaluations of 20 high-priority chemical substances under the Toxic Substances Control […]

Do You Have a Stormwater Permit for Your Facility?

By Kelly Scanlon, director, environment, health and safety policy and research, IPC The U.S. Environmental Protection Associations (EPA) is seeking public comment on a proposed 2020 National Pollutant Discharge Elimination System (NPDES) Multi-Sector General Permit (MSGP) for stormwater discharges from industrial activity. This proposed permit would replace the 2015 MSGP upon finalization. This proposed permit […]

An IPC Policy Roadmap to Economic Recovery

By Chris Mitchell, vice president, global government relations As the unprecedented COVID-19 crisis continues to unfold, IPC is calling for a bold, sustained policy agenda to help the electronics manufacturing sector weather the economic downturn and support the economic recovery. There can be no doubt that governments all over the world should take extraordinary measures […]

Important Update Regarding the TSCA Fees Rule and Your Company

By Kelly Scanlon, director, environment, health and safety policy and research, IPC Over the past month, IPC has brought to your attention that the TSCA Fees Rule may apply to your company beginning in 2020 and that there could be several challenges for those who need to comply. Challenges include the requirement to self-identify as […]

Delta Group Electronics Hosts Production of IPC Wire Crimping Video

By Mark Pritchard, director, media training Delta Group Electronics of Dallas, Texas hosted the production of a new IPC video on Wire Crimping, December 9-12, 2019. This is the sixth IPC video that Delta Group Electronics has hosted. Four of these videos have already won industry awards for video training. Safety in Electronics Assembly – […]

Where Can you Find a Suitable Surface Finish for 5G, High Frequency, and High-Density Applications?

By Kunil Shah, Ph.D., chief scientist, LiloTree The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovation in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance […]