Category Archives: Standards

Don Dupriest Elected to Chair Top IPC Standards Leadership Committee

Don Dupriest, Lockheed Martin Missiles & Fire Control, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Dupriest succeeds Chris Mahanna of Robisan Laboratory, Inc., who held the role for IPC’s top standards development oversight committee for the past two years. As a Lockheed Martin Fellow on Lockheed […]

In Memoriam – Brian Butler

It is with deep sadness that IPC announces the death of one of its valued committee members and leaders, Brian Butler, president and CEO of Introbotix, Corp. Brian passed away on March 11, 2018. Brian joined the IPC D-21c High Speed/High Frequency Controlled Impedance Task Group in early 2000. He volunteered for numerous IPC task […]

IPC Publishes New Standard on Low Pressure Molding for Circuitry Encapsulation

IPC-7621 offers cost-effect alternative to potting IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation. Unlike potting, where the […]

In Search of High Reliability in Printed Board Fabrication for Medical Device Applications

By John Perry, Director of Printed Board Standards & Technology It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies. Intended to reflect differences in producibility, complexity, […]

IPC E-Textiles Standards Committee Seeks Comments on Draft of New E-Textiles Standard; Participants Needed to Join Subcommittee to Develop E-Textiles Connectors Guideline

By Chris Jorgensen, director, technology transfer The IPC E-Textiles Materials Subcommittee is collecting comments on the first sections of IPC-4931, Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns. This standard will establish the classification system, qualification and quality conformance requirements and electrical/electronic performance requirements for electronically integrated textiles (e-textiles). It also covers similar […]

IPC Releases G Revisions of Two Widely Used Standards, IPC-A-610 and IPC J-STD-001

IPC has released the G revisions of the two most widely used standards in the electronic industry, IPC-J-STD-001, Requirements of Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. These two documents are on a three-year renewal cycle, keeping pace with the ever-changing technology within the electronics industry. Often used as companion documents, […]

IPC to Host Free Webinar on New E-Textiles Standard Activity

by Chris Jorgensen, Director, Technology Transfer Does your company manufacture or purchase e-textiles materials for use in your products? If so, you will want to attend a free IPC webinar on a new standard being developed by the IPC E-Textiles Materials Subcommittee. IPC-4931, Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns will be […]

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

IPC Standards Committee Reports — Assembly and Joining, Product Assurance

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Assembly and Joining The 5-20 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the […]

IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports. Printed Board Design The 1-10b Printed Board Thermal Management Task Group met to discuss future testing programs for the evaluation of […]