Category Archives: Standards

IPC CFX/Hermes Standards – The Future of Electronics is Here

John Mitchell, IPC president and CEO, describes how IPC Standards IPC-2591 and IPC-HERMES-9852 are providing the electronics industry the building blocks for machine-to-machine and machine-to-ERP communications.

Saying Yes to Opportunities: IPC’s Emerging Engineer Program Offers Career Growth for Electronics Industry Newcomers

What makes the IPC Emerging Engineer Program a premier networking and career enriching program? IPC staff spoke to Emerging Engineer Kate Stees, materials & process engineer, Lockheed Martin, about her experience in the program and why she recommends it to other engineers. IPC: Why did you choose to enroll in IPC’s Emerging Engineer program? Stees: […]

Microvia Subcommittee Brings Industry Together, Hosts Open Forum

By Chris Jorgensen, IPC director, technology transfer; IPC staff liaison to V-TSL MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee In early 2018, Jerry Magera and J.R. Strickland, Motorola, answered a call for white papers from the IPC V-TSL Technology Solutions Committee. Their white paper, IPC-WP-023, casts a light on an issue that has been […]

IPC Digital Factory at IPC APEX EXPO 2019 to Spotlight Real-world Implementation of IPC CFX Standard

by David Bergman, vice president, Standards and Training If you had the chance to align your EMS facility with Industry 4.0, set up seamless data communication between all equipment on your line – even conveyors – and be able to track production on all the equipment from any part of the world, would you do […]

Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC […]

Join the IPC E-Textiles Standards Group in Europe

By Chris Jorgensen, director, technology transfer IPC has received interest from several volunteers in Europe to form an e-textiles standards interest group in Europe. Volunteers from this group would meet to influence IPC standards activities, form working groups to develop new IPC standards and to network under the umbrella of developing standards. If you would […]

Top Reasons to Attend IPC APEX EXPO 2019

IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business.

IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white […]

IPC to Host Web Meeting on Forming IPC E-Textiles Committee Europe Working Groups

By Chris Jorgensen, director, technology transfer IPC will host an open-invitation web meeting for European organizations involved in e-textiles technologies to form a working group or groups under the IPC D-70 E-Textiles Committee. As the D-70 Committee expands its standards development activities, IPC has received interest from committee members in Europe to form a local […]

IPC and AATCC to Host Joint Session at AATCC Committee Meetings

By Chris Jorgensen, director, IPC technology transfer IPC and the American Association of Textile Chemists and Colorists (AATCC) will host a joint session, Get Hands-On With E-Textiles Standards and Test Methods, Monday, November 12, 3:00-5:00 pm (ET), prior to the AATCC Fall Committee Meetings. During this session, IPC and AATCC will provide an overview of […]