Category Archives: Materials

IPC to Host Free Webinar on New E-Textiles Standard Activity

by Chris Jorgensen, Director, Technology Transfer Does your company manufacture or purchase e-textiles materials for use in your products? If so, you will want to attend a free IPC webinar on a new standard being developed by the IPC E-Textiles Materials Subcommittee. IPC-4931, Requirements for Electronic Textiles (E-Textiles), Conductive Fibers and Conductive Yarns will be […]

IPC Standards Committee Reports — Base Materials, Assembly & Joining, Cleaning & Coating, Flex Circuits, High Speed/High Frequency

These standards committee reports from IPC’s 2016 Fall Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully Balloted the Amendment 2 to the IPC-4101D-WAM1, Specification for Base Materials for Rigid and […]

New Electronics Industry Market Data Now Available by Subscription

IPC is introducing three new quarterly subscription reports. These exclusive reports provide electronics manufacturers a competitive edge that comes from having solid, timely and reliable market research data. Reports include: Global Solder Market Report  – The report covers trends in solder and flux consumption, including growth rates, tin/lead vs. lead-free ratios, and industry growth outlook […]

IPC Standards Committee Reports – Component Traceability, Base Materials, Fabrication Processes, Assembly and Joining

These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Component Traceability The 2-19a Critical Components Traceability Task Group held its first face-to-face meeting to continue development of the working […]

IPC Standards Committee Reports — Printed Board Design, Cleaning & Coating, Testing, Process Control, Product Assurance

IPC Standards Committee Reports These standards committee reports from the 2015 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the first in the series of reports Printed Board Design The 1-10c Test Coupon and Artwork Generation Task Group met to review the […]

IPC-4101D-WAM1 Brings Significant Changes and Clarifications

If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. Why wait? Upgrade to the IPC-4101D-WAM1 today! IPC-4101D-WAM1 […]

IPC Standards Committee Reports — High Speed/High Frequency, Rigid Printed Boards, Embedded Devices, Printed Electronics

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the third in a series of reports. High Speed/High Frequency The D-22 High Speed/High Frequency Performance Subcommittee reviewed and approved requirements for copper wrap, employment of filleting/tear drops for lands, […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly and Joining, Flexible Circuits

These standards committee reports from IPC APEX EXPO 2015 have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully examined both Amendments 1 and 2 to the IPC-4101D, Specification for Base Materials for Rigid […]

Four IPC Global Statistical Programs Now Open

IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC member companies as a benefit of membership. The statistical programs give participating IPC members access to global […]

IPC Standards Committee Reports — Base Materials, Fabrication, Assembly & Joining, Flex Circuits

These standards committee reports from the 2014 Fall Standards Committee Meetings have been compiled to help keep you up to date on IPC standards committee activities. This is the second in a series of reports. Base Materials The 3-11 Laminate/Prepreg Materials Subcommittee successfully revised, balloted and released IPC-4101D, Specification for Base Materials for Rigid and Multilayer […]