Category Archives: IPC APEX EXPO

Technology Spotlight: How Semi-Additive Processes Enable Finer Circuit Features

By Tara Dunn, president, Omni PCB Can you imagine the benefits of routing with a 25-micron trace and space? Just to name a few; complex pin outs would require fewer layers and a decrease in costly lamination cycles, the overall size of the PCB could be dramatically reduced, or conversely, additional electronics could be fit […]

A Conversation with Karen McConnell — An Emerging Engineer Program Mentor

by Linda Stepanich, multimedia writer, IPC IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, […]

IPC APEX EXPO 2019: Hear from the Attendees

IPC APEX EXPO 2019, where technology’s future came to together with 9,796 attendees from 56 countries and 440 exhibitors from around the world. Join us in San Diego for IPC APEX EXPO 2020!

Seven Takeaways from IPC APEX EXPO 2019

By Chris Mitchell, IPC Vice President of Global Government Relations IPC’s most recent annual conference and trade show, IPC APEX EXPO 2019, took place in late January, and by all indications, it was among the best IPC shows ever! The overall success and quality of IPC APEX EXPO is a testament to the innovation and […]

Tell Us Your IPC Member Story at IPC APEX EXPO 2019

IPC will soon roll out a new membership campaign that will focus on how the electronics industry builds the electronics that improve the quality of life for billions around the globe. And we want help from IPC members. Do you have a story to tell about how IPC membership has helped your organization consistently deliver […]

IPC Digital Factory at IPC APEX EXPO 2019 to Spotlight Real-world Implementation of IPC CFX Standard

by David Bergman, vice president, Standards and Training If you had the chance to align your EMS facility with Industry 4.0, set up seamless data communication between all equipment on your line – even conveyors – and be able to track production on all the equipment from any part of the world, would you do […]

Fabrication and Assembly Challenges to be Covered at the Executive Forum for Advancing Automotive Electronics at IPC APEX EXPO 2019

Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to […]

Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC […]

Top Reasons to Attend IPC APEX EXPO 2019

IPC president and CEO John Mitchell invites you to attend IPC APEX EXPO 2019. From the show floor to the class room and all points in between, IPC APEX EXPO 2019 is THE place to be to learn, network, and conduct business.

IPC Subcommittee to Host Open Forum on Weak Microvia Interface During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee, formed this year, is working to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The activity grew out of the development of IPC-WP-023, a white […]